March 22, 2013. Archived from the original (PDF) on January 8, 2015.

Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron.

Other types are proprietary designations that may be made by only one or two manufacturers.

Integrated circuit packaging is the last assembly process before testing and shipping devices to customers.

In flip chip systems the IC is connected by solder bumps to a substrate.

Assemblies using bare chips have additional packaging or filling with epoxy to protect the devices from moisture.

The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.

Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J.

Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.

It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy.

Also used for LEDs.

Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead.

To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm 0.0254 100 mil).

The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC ).

Exceptions occur for imperial in the two smallest rectangular passive sizes.

The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned.

Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm 0.125 mm (0.0098 in 0.0049 in), 32 but the imperial 01005 name is already being used for the 0.4 mm 0.2 mm (0.0157 in 0.0079 in) package.

These increasingly small sizes, especially 0201 and 01005, can sometimes be a challenge from a manufacturability or reliability perspective.

Common in aviation electronics because of robustness to mechanical vibration.

Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.

The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy glob-top.

Tape-automated bonding process is also a chip-on-flex process as well.

Such wire may then be covered with cotton, glass or other materials to make into smart textiles or electronic textiles.

Sixth Annual IEEE International ASIC Conference and Exhibit.

Ieeexplore.ieee.org.

ASIC.1993.410760.

ISBN 978-0-7803-1375-0.

Package To Package Spacing Allegro